DTA 1376/1376A

Arm-Based Desktop uCPE for Wireless Broadband Applications w/ NXP® Layerscape® LS1046A SoC Processor
  • 產品特色
  • NXP® Layerscape® LS1046A SoC processor, BGA type
  • 1 x DDR4-2133 SO-DIMM ECC socket, up to 16GB
  • 1 x M.2 2242 NVMe SSD
  • 7 x 1GbE RJ45 ports
  • 1 x M.2 3042/3052 for 4G LTE/5G (FR1) module
  • 1 x mini-PCIe slot for Wi-Fi 5 module
  • PoE++ PD (DTA 1376A)
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產品型錄 (PDF)
Main Board NXP® Layerscape® LS1046A SoC processor, BGA type, 4 Cortex-A72 cores, 1.8GHz Supports DPAA
Memory 1 x DDR4 2133 SO-DIMM ECC socket, up to 16GB
Storage 1 x SPI NOR Flash 64MB for U-Boot 1 x M.2 2242 Key M, supports NVMe SSD with PCIe Gen3 x2 1 x Micro SD slot (optional)
LAN Features 7 x 1GbE RJ45 ports
Interface External SW1/SW2/SW3/power LEDs Ethernet LED: active/link speed 2 x USB 3.0 1 x Nano sim slot 1 x DC-in 12VDC 1 x Power button 1 x RJ45 console port 1 x Reset button 6 x SMA connectors (sides: 4 x for 4G LTE/5G antennas, back: 2 x for Wi-Fi 5 antennas) 7 x 1GbE RJ45 ports
Interface internal 1 x mini-PCIe for Wi-Fi 5 module 1 x M.2 3042/3052 for 4G LTE/5G FR1 module 1 x M.2 2242 Key M for NVMe SSD 1 x Micro SD slot (optional)
Power 1 x 40W 12V AC power adapter 1 x RJ45 port for PoE++ PD (DTA 1376A)
Dimension and Weight Chassis dimension (mm): 225mm x 150mm x 44mm (W x D x H) Package dimension(mm): 343 x 258 x 212 (W x D x H) Without packing: 1.5kg With packing: 2.5kg
Environment Operating temperature: 0°C~40°C Storage temperature: -20°C~80°C Relative humidity: 10%~90% non-condensing
Certification CE/FCC class B LVD
Software Development Kit NXP® Layerscape SDK 20.04-NEXCOM DTA 1376 revision
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