vROK 3030-A-B

搭載 Intel Atom® x6414RE 處理器的10.4吋鐵路專用面板安裝電腦
  • 產品特色
  • 搭載 Intel Atom® x6414RE 處理器，熱設計功耗 (TDP, 9W)
  • 10.4 吋 TFT LCD 監視器，配備 PCAP 觸控功能
  • IPS LCD 具廣視角，解析度支援 1024x768
  • 面板亮度達 1,200 尼特，確保在陽光下仍能正常閱讀
  • 1 x HDMI®、1 x DP 視訊輸出，支援三螢幕顯示
  • 1 x 隔離式 CAN 匯流排 2.0
  • 4 x CVBS 輸入支援類比攝影機（需搭配選購擷取卡）
  • 2 x PoE 埠支援 IP 攝影機（選購）
  • 面板安裝設計 (Panel Mount) 可支援廣泛的應用需求
  • 通過 EN 50155, class OT3 鐵路認證
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產品型錄 (PDF)
LCD Panel 10.4-inch TFT LCD panel with LED backlight 1024x768 pixels Brightness: 1200cd/m² (typical) Viewing angle: 170° (H)/170° (V) Contrast ratio: 900:1 (typical)
Touch Screen Projected capacitive Anti-glare coating surface Transmission rate: 85% ± 3%
CPU Intel Atom® x6414RE processor, TDP 9W
Memory 1 x 260-pin DDR4 3200 SO-DIMM, up to 32GB Default 2666MHz 4GB with In-Band ECC (IBECC)
Video Output 1 x HDMI® 1.4b, up to 3840x2160@30Hz 1 x DP 1.4, up to 4096x2160@60Hz
Storage 1 x M.2 Key M 2280 socket (SATA 3.0 or PCle 3.0 x1) 1 x mSATA (occupied Mini PCIe slot)
Expansion 1 x M.2 Key E 2230 socket (USB 2.0, PCIe 3.0 x2) 1 x Full size Mini PCIe socket (USB 2.0, PCIe 3.0/SATA 3.0) 1 x M.2 Key B 3042/3050/3052 socket (USB 2.0, USB 3.2 Gen 2) for LTE/5G NR module, BOM optional 1 x full size Mini PCIe socket (USB 2.0, USB 3.2 Gen 2 (BOM optional)) for LTE module, with 1 x external micro-SIM slot, 1 x internal micro-SIM slot
GNSS and Onboard Sensor 1 x Default u-blox NEO-M9N GNSS module for GPS + QZSS/Glonass/Galileo/Beidou 1 x 3D accelerometer and 3D gyroscope
LAN and Power over Ethernet 2 x LAN M12 X-coded, 10/100/1000/2500Mbps, Intel® I225-IT
(optional PoE 802.3 af/at, max. 30W, w/ VIOD-POE2-01)
Security TPM 2.0: Infineon SLB 9670VQ2.0 FW7.62
I/O Interface-Lateral Right side
- 1 x System reset button
- 1 x USB 3.2 Gen 2 Type-A connector
- 1 x micro-SIM slot w/ cover
I/O Interface-Rear 2 x DB9 (COM1/COM2) for full RS-232/422/485 (w/ isolation) 1 x Power connector, M12 A-coded 5-pin 2 x 10/100/1000/2500Mbps LAN, M12 X-coded 8-pin 1 x M12 A-coded 8-pin for 2 x USB 2.0 1 x Line in (stereo), 2 x Line out (setreo) (AUDIO, DB9, female) 1 x HDMI® output 1 x DP output 1 x M12 (MULTI PORT, A-coded 17-pin)
- 4 x DI (w/ isolation)
- 2 x DO (w/ isolation)
- DC 14V~48V power input for DIO isolation
- 1 x Isolated CAN bus 2.0B
- 1 x Power button
- 4 x Composite video input 1 x RP-SMA connector hole for Bluetooth 3 x RP-SMA connector hole for WLAN 2 x SMA connector hole for WWAN 1 x SMA connector for GNSS 1 x Ground connector
Mechanical Cooling system: fanless Enclosure: metal Ingress protection: front panel IP65 Mounting: panel mount, VESA 75 mount Dimensions: 336.0mm (W) x 257.6mm (D) x 73.7mm (H) Cutout dimension: 285.6mm x 207.2mm Weight: 3.9kg
Power Management DC 24V/36V (14V~48V) input, w/o isolation DC 24V/110V input, w/ isolation (BOM optional) Reverse protection, OCP & UVP Selectable boot-up & shut-down voltage for low power protection by software Setting 8-level power on/off delay time by software 10~255 seconds WDT supported, setup by software SDK (Windows/Linux) including utility and sample code
Environment Operating temperature:
- -30°C~70°C, 85°C for 10 minutes (w/ 9W TDP CPU, industrial SSD) with air flow
- -30°C~60°C, w/ 9W TDP CPU, industrial SSD, PoE, with air flow Storage temperature: -40°C~80°C Relative humidity: 10%~90% (non-condensing) Vibration (random): 2g@5Hz~500Hz (in operation, SSD) Vibration
- Operating: MIL-STD-810H, 514.8C Procedure 1, Category 4
- Storage: MIL-STD-810H, 514.8E Procedure 1, Category 24 Shock
- Operating: MIL-STD-810H, Method 516.6,
Procedure I, trucks and semi-trailers = 40g
- Crash hazard: MIL-STD-810H, Method 516.6,
Procedure V, ground equipment = 75g
Operating System Windows 10 Windows 11 Linux
Standards/Certifications CE FCC Class A EN 50155:2017
- Ambient temperature EN 50155, Class OT3
- Interruptions of voltage supply class S1
- Supply change over class C1
- EMC EN 50121-1:2017, EN 50121-3-2:2016+A1:2019
- Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30
- Shock and vibration IEC 61373 Class B
- Protective coating class PC1 (PC2, by request) EN 45545-2:2020 (PCB)
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