ICES 674

COM Express Type 6-pinouts, 6/7th Gen. Intel® Core™/Xeon® Processors
  • 產品特色
  • Onboard 6/7th Gen Intel® Core™ i7/i5/i3/Xeon® + PCH QM175/CM238 (optional)
  • 2 channel DDR4 with non-ECC/SO-DIMM 2133MHZ up to 32GB
  • Support display LVDS/VGA/DDI 1/DDI 2
  • PCIe x16/8 PCIe x1, 4 x USB 3.0, 8 x USB 2.0, 4 x SATA 3.0 and GBE
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產品型錄 (PDF)

Barebone

ICES 674 (P/N: 10K00067400X0)
On-board Intel® 7th i7-7820E processor, w/DDR4 SO-DIMM, support multiple display from VGA/LVDSD/DDI1/2, 4 x SATA III, 1x GbE LAN, 2 x COM, 4 x USB 3.0, 8 x USB 2.0, HD audio, 8bit GPIO

 

ICES 674-644EQ (P/N: 10K00067401X0)
On-board Intel® 6th ICES 674-644 EQ processor, w/DDR4 SO-DIMM, support multiple display from VGA/LVDSD/DDI1/2, 4 x SATA III, 1 x GbE LAN, 2 x COM, 4 x USB 3.0, 8 x USB 2.0, HD audio, 8-bit GPIO

 

Optional Accessories
ICES 674 heat spreader thermal pad screw (P/N: 79K0067401X00)

 

ICES 674 cpu cooler fan heat sink screw (P/N: 79K0067402X00)

 

Notice
Heat spreader: The heat spreader acts as a thermal coupling device to the module and is thermally coupled to the CPU via a thermal gap filler. On some modules, it may also be thermally coupled to other heat generating components with the use of additional thermal gap fillers. Although the heatspreader is the thermal interface where most of the heat generated by the module is dissipated, it is not to be considered as a heatsink. It has been designed as a thermal interface between the module and the application specific thermal solution.

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