ICES 668

COM Express Type 6 Basic Module with Intel® QM77, Intel® 3rd Generation Core™ i7/ i5/ i3 Processors with ECC

產品特色
Embedded Intel® 3rd generation Core™ i7/ i5/ i3 processor, Ivy Bridge Mbl + ECC
Intel® QM77 PCH chipset support PICMG COM.0 Rev. 2.0 Type 6 pin-outs
Support Dual channel DDR3 with ECC SO-DIMMs 1333/1600MHz up to 16GB
Support PCIe x16, 7x PCIe x1, 4x USB3.0/ 8x USB 2.0, 2x SATA 3.0/ 2x SATA 2.0 and GbE
Up to 3x Independent Displays, VGA, Dual Channels 18/24-bit LVDS, DVI, HDMI, DisplayPort
Dimension 95mm (W) x 125mm (L)

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產品型錄 (PDF)

The ICES 668 is a Type 6 pin-outs COM Express Basic module featuring Intel^® QM77 PCH chipset supports Intel^® 3rd generation Intel^® Core™ processor with Dual DDR3 SO-DIMM socket up to 16GB DDR3 1333/ 1600MHz SDRAM with ECC support. The ICES 668 integrated Intel^® HD graphics with DX11 support or expands via PCI Express Graphic 1x 16 lanes and support three DDI (Digital Display Interface) to follow the standard of PICMG COM.0 Rev. 2.0 specification. It allows type 6 pin-out Carrier board to implement HDMI, DVI, Display Port, SDVO and legacy VGA, 18/24 bits LVDS interface. The high performance ICES 668 COM Express Basic Module supports 4x USB 3.0/ 8x USB 2.0, 2x SATA 3.0/ 2x SATA 2.0 and 7x PCIe x 1 lanes through our NEXCOM in-house designed ICEB 8060 evaluation carrier MB as well as customized solution for your embedded OEM/ ODM projects.

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